CECHA01 with Ylod after RSX IHS remove

Begonnen von Nissan, 03. November 2012, 21:23:42

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Nissan

Hello to all Trisaster's participants! This is my second post and I wrote in English because I not  speak German!

I bought a CECHA01 with he following defect, after 2 minutes the cooler reached the last level and the PS3 shutdown without display any message error, I tried changing  the thermal paste  over the RSX IHS, but the defect remained.

Then I decided to remove the IHS, and to my surprise the older owner had already removed and changed the internal thermal paste, but the older owner pasted the IHS with instant glue, then the central part of the RSX not touched the IHS. Carefully I removed the IHS and removed all the glue residue, but after reassemble the PS3 I got YLOD, I tried 3 reflows with heat gun but without sucess.

Turn on the PS3 several times the CELL gets hot and the RSX a little warm.

What can I do? Does the RSX was damaged or was crack in the BGA?

Takeshi

Hello to Brazil! :)

That's bad with the instant glue. Did you slip down while removing the glue? Can you make a picture of the RSX? It's not easy to find out, if it's a broken solder or a broken RSX.

DoggyDog

Maybe the RSX overheats already during your attempts keeping the console run? Also possible, that the RAM on the RSX-PCB causes the YOLD? As far as i know, RAM is much more sensitive with overheating, maybe collateral damages on RSX-Memory causes your YLOD?

Nissan

Thanks Takeshi and DoggyDog.

The surface of the RSX is not damaged, I'm afraid that instant glue damaged the BGA RSX's memory.



The red circles indicate where the glue was applied by the older owner.
The blue circle was a small risk in surface when I was removing the glue.




DoggyDog, the Ylod appeared after I remove the IHS, I only removed the IHS and the glue, put a new thermal paste and assemble the PS3


Nissan

I used AMTECH NC559-ASM in reflow. It is indicated for reflow?

Dragoon

Hi to brasil :D

Im not a pro in this issue, but the little scratch in the blue cirle could be the reason for your problem.
soldering flux is not very recommend for reflows.

DoggyDog

Dragoon, i always thought that soldering flux is highly recommend for reflows?

RalleBert

#7
Hi Nissan,

the flux you used is ok, but it seems to be a paste, that makes it hard to get under the whole RSX. It seems to be for reballing. Maybe you can warm up the board to get the paste to melt and then it spreads better under the RSX. A liquid flux would be better, we have rosin solution (old fashioned flux) here, give me your adress and you get a sample.
The scratch looks not so deep, please make a more datailed picture.
Maybe the RAM, the four black blocks on the RSX have been damaged. They are also BGA chips on the surface of the RSX. If the cyanoacrylate adhesive was so powerful, the soldering of the Ram has broken.

Zitat von: DoggyDog am 04. November 2012, 15:54:44
Dragoon, i always thought that soldering flux is highly recommend for reflows?

Totally correct - or would you drive your car without engine oil?!
A "dry" reflow is possible, but for better durability and higer chance of success you should use flux.

- veni, vidi, ferruminavi -
- ich kam, ich sah, ich l?tete -

Dragoon

I didn't ment it the way you guys lay it out i had ment it.
I ment it like, it is paste, good for rebaling, but not reflow. A more liquid flux would be better  ::)

RalleBert

Maybe you should ~mean~ a bit more precisely next time ;)

- veni, vidi, ferruminavi -
- ich kam, ich sah, ich l?tete -

Nissan

#10
Hello everybody!

I apologize for not answering soon, I work in an inner city and I can test the PS3 only on weekends, then only on Saturday is that I post a new picture or video for you.

To melt the NC559-ASM I did like this video: http://www.youtube.com/watch?v=NHr1tPwTOVA&feature=related

Although it is a possibility I have hope that the defect is only in the RSX's BGA and not in the RSX's memories.

I wanted to make the process of Reflow slower, but I'm afraid that bubbles appear on the motherboard. I use Black & Decker HG2000K heat gun (http://www.bdferramentas.com.br/prod/cata/listProdDeta.asp?prodID=HG2000K&idGrup=Aces) and would like to know what the maximum temperature that can be used, although I always place at a temperature below 350 ° C and the time required for the process. Currently I am following the Takeshi's tutorial.

Takeshi

There are bubbles on the PCB? That is bad, then often the board is already corrupted.

It's not possible to make a general statement about the temperature, because the temperature alternates rom heatgun to heatgun. If i set my heatgun to 300°C, the air has only about 250°C at the front (and that is enough at all). Now it is not pissble to say which temperature you have to set up to get about 250°C at the front. Because of this I chosen a small temperature in my tutorial, so if the air of heatgun at the preset temperature is very high, it is still not too much.

RalleBert

Hi Nissan,

you don´t have to apologize! We will see if the demage on the RSX´s surface is dangerous or not when you can send the picture. For me, seen from the photos you have provided, it seem not to be the scratch.
Are you able to control the temperature of the mainboard whlie reflowing? That could help.
The Youtubevideo is what i saw not recommended to guide you, they don´t remove the RSX´s IHS, thats not very well! The guys are using professional equipment, but to leave on the IHS for a reflow is not so very professional. The apply of the flux looks usable, better a bit too much than a bit too less.

@Takeshi: He´s afraid of getting bubbles on the PCB, they have not apeared until now.

- veni, vidi, ferruminavi -
- ich kam, ich sah, ich l?tete -

Dragoon

guys, you got to fresh up your english  ::) many mistakes in grammar and spelling  ::)

the tutorial is not...very professional, only the equipment.
not removing the IHS or how he applies the thermal compound is not recommend.
by not removing the IHS from the RSX and Cell you can damage the thermal compound between Dice and IHS, new thermal compound on top of the IHS would do nothing better then.
the way he applies thermal compound, you get many bubbles into the compound and in fact of this, the heat transfer will suffer.

grave_digga

Zitat von: Dragoon am 07. November 2012, 11:03:39
guys, you got to fresh up your english  ::) many mistakes in grammar and spelling  ::)

You too young padawan. But this didn't helps Nissan much out so just try to be as precise as possible and don't look at the grammar that much.
<- Der da ist gerne hier. :)