Hello to all Trisaster's participants! This is my second post and I wrote in English because I not speak German!
I bought a CECHA01 with he following defect, after 2 minutes the cooler reached the last level and the PS3 shutdown without display any message error, I tried changing the thermal paste over the RSX IHS, but the defect remained.
Then I decided to remove the IHS, and to my surprise the older owner had already removed and changed the internal thermal paste, but the older owner pasted the IHS with instant glue, then the central part of the RSX not touched the IHS. Carefully I removed the IHS and removed all the glue residue, but after reassemble the PS3 I got YLOD, I tried 3 reflows with heat gun but without sucess.
Turn on the PS3 several times the CELL gets hot and the RSX a little warm.
What can I do? Does the RSX was damaged or was crack in the BGA?
Hello to Brazil! :)
That's bad with the instant glue. Did you slip down while removing the glue? Can you make a picture of the RSX? It's not easy to find out, if it's a broken solder or a broken RSX.
Maybe the RSX overheats already during your attempts keeping the console run? Also possible, that the RAM on the RSX-PCB causes the YOLD? As far as i know, RAM is much more sensitive with overheating, maybe collateral damages on RSX-Memory causes your YLOD?
Thanks Takeshi and DoggyDog.
The surface of the RSX is not damaged, I'm afraid that instant glue damaged the BGA RSX's memory.
(https://lh3.googleusercontent.com/-HfdLVJqfOVI/UJZaGnkiIGI/AAAAAAAAAK8/MpomqXa2APc/s576/rsx.png)
The red circles indicate where the glue was applied by the older owner.
The blue circle was a small risk in surface when I was removing the glue.
(https://lh5.googleusercontent.com/-im2KZ62V6mU/UJZZ0-CzexI/AAAAAAAAAK0/Yel35lwDpeQ/s576/DSC_0211.jpg)
(https://lh5.googleusercontent.com/-CDwKYk8OSpI/UJZZ0r_csHI/AAAAAAAAAKs/mlIh97YGbg0/s576/DSC_0210.jpg)
DoggyDog, the Ylod appeared after I remove the IHS, I only removed the IHS and the glue, put a new thermal paste and assemble the PS3
I used AMTECH NC559-ASM in reflow. It is indicated for reflow?
Hi to brasil :D
Im not a pro in this issue, but the little scratch in the blue cirle could be the reason for your problem.
soldering flux is not very recommend for reflows.
Dragoon, i always thought that soldering flux is highly recommend for reflows?
Hi Nissan,
the flux you used is ok, but it seems to be a paste, that makes it hard to get under the whole RSX. It seems to be for reballing. Maybe you can warm up the board to get the paste to melt and then it spreads better under the RSX. A liquid flux would be better, we have rosin solution (http://www.trisaster.de/forum/index.php?topic=2329.0) (old fashioned flux) here, give me your adress and you get a sample.
The scratch looks not so deep, please make a more datailed picture.
Maybe the RAM, the four black blocks on the RSX have been damaged. They are also BGA chips on the surface of the RSX. If the cyanoacrylate adhesive was so powerful, the soldering of the Ram has broken.
Zitat von: DoggyDog am 04. November 2012, 15:54:44
Dragoon, i always thought that soldering flux is highly recommend for reflows?
Totally correct - or would you drive your car without engine oil?!
A "dry" reflow is possible, but for better durability and higer chance of success you should use flux.
I didn't ment it the way you guys lay it out i had ment it.
I ment it like, it is paste, good for rebaling, but not reflow. A more liquid flux would be better ::)
Maybe you should ~mean~ a bit more precisely next time ;)
Hello everybody!
I apologize for not answering soon, I work in an inner city and I can test the PS3 only on weekends, then only on Saturday is that I post a new picture or video for you.
To melt the NC559-ASM I did like this video: http://www.youtube.com/watch?v=NHr1tPwTOVA&feature=related
Although it is a possibility I have hope that the defect is only in the RSX's BGA and not in the RSX's memories.
I wanted to make the process of Reflow slower, but I'm afraid that bubbles appear on the motherboard. I use Black & Decker HG2000K heat gun (http://www.bdferramentas.com.br/prod/cata/listProdDeta.asp?prodID=HG2000K&idGrup=Aces) and would like to know what the maximum temperature that can be used, although I always place at a temperature below 350 ° C and the time required for the process. Currently I am following the Takeshi's tutorial.
There are bubbles on the PCB? That is bad, then often the board is already corrupted.
It's not possible to make a general statement about the temperature, because the temperature alternates rom heatgun to heatgun. If i set my heatgun to 300°C, the air has only about 250°C at the front (and that is enough at all). Now it is not pissble to say which temperature you have to set up to get about 250°C at the front. Because of this I chosen a small temperature in my tutorial, so if the air of heatgun at the preset temperature is very high, it is still not too much.
Hi Nissan,
you don´t have to apologize! We will see if the demage on the RSX´s surface is dangerous or not when you can send the picture. For me, seen from the photos you have provided, it seem not to be the scratch.
Are you able to control the temperature of the mainboard whlie reflowing? That could help.
The Youtubevideo is what i saw not recommended to guide you, they don´t remove the RSX´s IHS, thats not very well! The guys are using professional equipment, but to leave on the IHS for a reflow is not so very professional. The apply of the flux looks usable, better a bit too much than a bit too less.
@Takeshi: He´s afraid of getting bubbles on the PCB, they have not apeared until now.
guys, you got to fresh up your english ::) many mistakes in grammar and spelling ::)
the tutorial is not...very professional, only the equipment.
not removing the IHS or how he applies the thermal compound is not recommend.
by not removing the IHS from the RSX and Cell you can damage the thermal compound between Dice and IHS, new thermal compound on top of the IHS would do nothing better then.
the way he applies thermal compound, you get many bubbles into the compound and in fact of this, the heat transfer will suffer.
Zitat von: Dragoon am 07. November 2012, 11:03:39
guys, you got to fresh up your english ::) many mistakes in grammar and spelling ::)
You too young padawan. But this didn't helps Nissan much out so just try to be as precise as possible and don't look at the grammar that much.
For Dragoon in german: Als ob es einen interessiert, wie unser Englisch hier ist, das ist doch wohl echt nebensächlich. Dass es nicht perfekt ist, weiß denke ich jeder selbst. Sollen wir deshalb einfach gar nichts schreiben? Davon wird es ganz sicher auch nicht besser. Konzentrier dich lieber auf den Inhalt, als auf die Rechtschreibung und Grammatik.
About the video again: He removed the IHS, remember his pictures. He only used this video for the reflow itself, that is all I think.
Hello everyone, sorry for the delay in responding, but I was too busy.
First, in response to previous posts, no matter if I write wrong, what matters is that we understand the mensage.
After trying about 5 reflows and CECHA01 continue with the defect, I decided to measure voltages in the motherboard.
On Sunday (03/12/2012 in Brazil or 12/03/2012) got some free time and went to check the CECHA01, I found several DC-DC converters that have no output voltage (Vout = 0). According to Service Manual for CECHA01 (SM-0013E-02-PS3) the converters operate from voltage levels to pin CONT (in some ENABLE), these buses are identified by SW * (SW1, SW3 ...) being that these voltages are controlled by the IC BRIDGE.
When checking the CI Brigde I realized that that did not exist 3.3V_BRIDGE and 1.5V_BRIDGE voltages, coming from IC6021 and IC6022, I also realized that the pin CONT(SW_PCI) of IC6021 and IC6022 are at low level.
The level (SW_PCI) is controlled by IC4002 (CXR713120-201GB-TL), all VCC pins of IC4002 are normal.
I also realized that the Q6600 has a resistance 30 OHM between the GATE and SOURCE pins, It not normal, because in CECHE01 this resistance not exist.
I have no idea where to look for the defect. Any help will be appreciated!
Currently I have not enough time to look for it, it is really specific. I only can say, there is a order in the boot-process. It is possible that boot-process terminates before the DC-DC converter get an EN-signal. The order ist controlled by the System Controller, the IC4002. Thit could be normal, but I don't know.
Couldn't it be, that 0V means "enable" in this case?
IC6600 is, as the name says, is not a FET, it is an IC, so it has no gate and soure.
Hello Takeshi, the Q6600 is correct, it is a FET, is on page 26 of the Service Manual and is connected to IC6602.
I think it is not an order in the boot process because I have a CECHE02 with short YLOD and yet it enables the DC-DC converters.
According to the datasheet IC6602, it works with high level.
Thanks for your attention!
Ok, I thought you mean IC6600 is a FET. The Q6600 is a FET, that's right.
There is an ordner in the boot-process, but that doesn't mean, that your error must be a result of it.
If the only failure is, that the SysCon doesn't put out the EN-signal, than the SysCon is broken and you can't do anything, because you could not replace it.